嘉碩32.768K晶體,TZ2065A無源晶振,2012mm小體積晶振,6G無線模塊晶振,尺寸2.0*1.2mm,頻率32.768KHZ,臺(tái)灣晶振,超小型晶振,兩腳貼片晶振,進(jìn)口音叉晶振,SMD晶振,水晶振動(dòng)子,無源晶體,石英晶體,音叉晶體,時(shí)鐘晶振,32.768KHZ晶振,2016mm貼片晶振,輕薄型晶體,低損耗晶振,低成本晶振,低功耗晶振,高性能晶振,高品質(zhì)貼片晶振,兒童游戲機(jī)晶振,時(shí)計(jì)專用晶振,數(shù)碼相機(jī)晶振,電話機(jī)晶振,藍(lán)牙耳機(jī)專用晶振,產(chǎn)品具有輕薄小低損耗的特點(diǎn).
32.768K晶振產(chǎn)品適用于范圍非常廣泛,比較適合用于兒童游戲機(jī),時(shí)計(jì),數(shù)碼相機(jī),電話機(jī),藍(lán)牙耳機(jī)等領(lǐng)域。嘉碩32.768K晶體,TZ2065A無源晶振,2012mm小體積晶振,6G無線模塊晶振.
嘉碩32.768K晶體,TZ2065A無源晶振,2012mm小體積晶振,6G無線模塊晶振參數(shù)表
TZ2065A | Specification |
NominalFrequency | 32.768000KHz |
Storage TemperatureRange | -40°Cto+85°C |
Operating TemperatureRange | -40°Cto+85°C |
Turnover Temperature | 25+/-5°C |
Parabolic CurvatureConstant | -0.027ppm/°C2max. |
FrequencyMakeTolerance(FL) | +/-20 ppm@25°C+/-3°C |
EquivalentSeriesResistor(ESR) | 90 Ωmax. |
Nominal DriveLevel | 10uW |
ShuntCapacitance(Co) | 2.0 pFmax |
DriveLevel | 0.5uWmax. |
LoadCapacitance(CL) | 12.5pF |
Aging | +/-3.0ppm/year@25°C |
Marking | Lasermarking |
InsulationResistance | 500MΩmin atDC100V |

嘉碩32.768K晶體,TZ2065A無源晶振,2012mm小體積晶振,6G無線模塊晶振 尺寸圖
32.768K產(chǎn)品特性:
陶瓷接縫封裝
卓越的可靠性性能
超微型封裝
可用于表面安裝技術(shù)和紅外回流工藝
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