Rakon launches Small Form Factor IC-OCXO with 8hr holdover for cloud data centres and next-generation telecom networks
Rakon has launched its first IC-OCXO products combining its in-house designed Mercury™ semiconductor chip and XMEMS® resonators under the brand MercuryX™. MercuryX OCXOs provide ultra-high stability and an extended holdover of 8 hours. in real-world conditions, all in a small form factor package size. The new OCXOs are an excellent fit for timing and synchronisation in AI computing / data centres and 5G, 5G Advanced and 6G telecommunications networks as well as satellite terminals and instrumentation.
Reza Sedehi, Head of Product Management at Rakon says: “The MercuryX products showcase the performance gains that are possible with next-generation quartz technology such as XMEMS. The initial 1000+ samples of MercuryX have generated high interest and positive feedback from tier-1 customers. The new products build on Rakon’s successful track record of consistently delivering high-quality ASIC based OCXOs (IC-OCXOs) in large volumes for over a decade.”
MercuryX follows the launch of Niku™, Rakon’s latest in-house designed ASIC semiconductor chip for Ultra Stable TCXOs, as the next entry in the company’s AI computing product portfolio.
The new MercuryX OCXOs offer a three-fold performance improvement on the current IC-OCXO range in terms of stability (±1.5 ppb), frequency slope (0.05 ppb/°C) and ageing (0.2 ppb/day). Even more importantly, MercuryX satisfies the much sought-after holdover requirements (8 hrs) for data centres and advanced telecom networks.
The development of its own in-house resonator and chip technology allows Rakon to control its product roadmap, creating market-leading products like MercuryX that are independently manufactured in its factories in New Zealand and India, providing customers with high security of supply.
The first product in the range is the ROM1490X in a 14 x 9 mm package, to be followed by a 7 x 5 mm product in mid 2024. Rakon is already working on the next iteration of the Mercury chip, with a new ASIC to be released in 2025 for further performance gains.
Key performance parameters of the ROM1490X:
Package: 14.2 x 9.2 x 6.5 mm, 6-pad, SMD
Frequency (Fn): 10 to 50 MHz
Operating temperature: - 40 to 95°C
Frequency stability (FvT): ±1.5 ppb
Holdover: 8 hrs
Frequency slope (ΔF/ΔT): 0.05 ppb/°C
Ageing: 0.2 ppb/day
G-sensitivity: 0.9 ppb/g
Custom MercuryX products with further optimised long-term stability through advanced I²C bus digital control, GNSS 1PPS input and/or machine learning are available on request.
Rakon推出了首款集成電路OCXO產(chǎn)品，結(jié)合了其內(nèi)部設(shè)計的Mercury半導(dǎo)體芯片和XMEMS®MercuryX品牌的諧振器。MercuryX OCXOs提供了超高的穩(wěn)定性和8小時的延長保持時間。在現(xiàn)實條件下，所有產(chǎn)品均采用小尺寸封裝。新型OCXO晶振非常適合人工智能計算/數(shù)據(jù)中心、5G、5G Advanced和6G電信網(wǎng)絡(luò)以及衛(wèi)星終端和儀器儀表的計時和同步。
Rakon產(chǎn)品管理主管Reza Sedehi表示:“MercuryX產(chǎn)品展示了下一代石英技術(shù)（如XMEMS）可能帶來的性能提升。首批1000多個MercuryX樣品引起了一級客戶的高度興趣和積極反饋。新產(chǎn)品建立在十多年來持續(xù)大批量提供高質(zhì)量基于ASIC的ocxo（IC-ocxo）的成功記錄基礎(chǔ)上。”
MercuryX之前推出了Niku，這是Rakon最新的內(nèi)部設(shè)計的用于超穩(wěn)定TCXOs的ASIC半導(dǎo)體芯片，是該公司人工智能計算產(chǎn)品組合的下一款產(chǎn)品。
新的MercuryX OCXO石英晶體振蕩器在穩(wěn)定性（1.5 ppb）、頻率斜率（0.05ppb/°C）和老化（0.2ppb/天）方面比當(dāng)前的IC-OCXO系列性能提高了三倍。更重要的是，MercuryX滿足了數(shù)據(jù)中心和先進電信網(wǎng)絡(luò)備受追捧的延期要求（8小時）。
開發(fā)自己的內(nèi)部諧振器和芯片技術(shù)使Rakon能夠控制其產(chǎn)品路線圖，創(chuàng)造出像MercuryX這樣的市場領(lǐng)先產(chǎn)品，這些產(chǎn)品在其新西蘭和印度的工廠中獨立生產(chǎn)，為客戶提供了高度的供應(yīng)保障。
該系列的首款產(chǎn)品是采用14x9mm封裝的ROM1490X，隨后將于2024年年中推出7x5mm產(chǎn)品。Rakon已經(jīng)在研究Mercury芯片的下一代產(chǎn)品，新的ASIC將于2025年發(fā)布，以進一步提高性能。
Rakon推出了首款集成電路OCXO產(chǎn)品
ROM1490X的主要性能參數(shù):封裝:14.2x9.2x6.5毫米，6焊盤貼片晶振
頻率：10MHz至50MHz
工作溫度：- 40℃至95℃
頻率穩(wěn)定性（FvT）:1.5 ppb
延期:8小時
頻率斜率（δF/δT）:0.05 ppb/℃
老化：0.2 ppb/天
重力敏感度：0.9 ppb/g
定制的MercuryX產(chǎn)品通過先進的I C總線數(shù)字控制、GNSS 1PPS輸入和/或機器學(xué)習(xí)進一步優(yōu)化了長期穩(wěn)定性。
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